SU-8 photoresist has many remarkable properties that are ideally suited for use in the fabrication of MEMS and microfluidic devices. SU-8 is a negative-imaging epoxy-type, near-UV photoresist that can be spun with uniform thickness up to 2 mm and its excellent transparency allows processing with standard mask aligners. Among the many merits of this photoresist for MEMS manufacture, is its chemical stability. Unfortunately SU-8 is so stable that its difficult to remove. PVA TePla has successfully developed a plasma process to remove SU-8 by plasma ashing.
The PS 300 series of microwave batch resist ashers ranges from manual to fully automated accommodating wafers from 2" to 8" (50 to 200 mm)
PS 300 Serie
Fully automatic single wafer resist
stripping system for implant resist
and MEMS applications for wafers
up to 300 mm
PS 90
Plasma system with large area planar
source technology for low temperature ashing of SU-8 and other sensitive organic layers. Used in MEMS-fabrication and OLED/PLED development. Holds one 300 mm wafer or four 150 mm wafers
PS 4008
Laboratory or pilot scale bench top microwave system ideal for resist ashing, wafer cleaning and decapsulation of electronic devices
PS 210
The PS600 is a RF type Batch Plasma asher for semiconductor frontend applications. It is the pendant to our Microwave Plasma System 300- but operates with 13.56 MHz.
