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Ultra Thin Wafers
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Plasma Based Solutions:
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Post CMP Treatment
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| Examples of Silicon Surfaces roughened by dry chemical etching after Remote Cold Plasma |
PVA Tepla's Remote cold plasma surface treatment can be used in combination with other traditional wafer stress-relief methods, e.g. CMP, to prepare the wafers for subsequent process steps. For example, plasma is used to prepare power devices for back-side metallization. Plasma cleaning, along with its micro-roughning effect, modifies the mirror like CMP surface improving its ability to be metallized. Post CMP treatment can be applied in-situ with Stress Relief and Wafer Thinning.
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Related Products: |
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Fully Automated Remote Plasma System with automatic substrate loading and unloading |
| GIGA 80 Plus ASYNTIS |
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Plasma System for processing of 6", 8", and 12" wafers / framed wafers |
| GIGAfab ASYNTIS M |
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