Post CMP Treatment

Examples of Silicon Surfaces roughened by dry chemical etching after Remote Cold Plasma

PVA Tepla's Remote cold plasma surface treatment can be used in combination with other traditional wafer stress-relief methods, e.g. CMP, to prepare the wafers for subsequent process steps. For example, plasma is used to prepare power devices for back-side metallization. Plasma cleaning, along with its micro-roughning effect, modifies the mirror like CMP surface improving its ability to be metallized. Post CMP treatment can be applied in-situ with Stress Relief and Wafer Thinning.

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