Plasma Cleaning prior to Flip Chip Underfill

Plasma cleaning in FlipChip packaging technology has become a must for yield improvement. Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies. All surfaces, regardless of the volume under the die are perfectly activated and conditioned. PVA TePla’s microwave plasma consistently performs, providing void-free FlipChip underfill, optimum adhesion and a dramatically enhanced wicking speeds. Application suitability goes well beyond die sizes of 20x20mm and 50µm bumps.

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