Semiconductor Packaging

Plasma systems for cleaning of substrates and devices, especially prior to wire bonding, flip chip underfill and device packaging.
Plasma systems for 3D integration, stress relief etching and wafer thinning on wafers or dies.

Cleaning of substrates and devices. Processing thin wafers. Die stress relief for 3D IC

Shows and Events

Please come and see us at Semicon Japan in December:

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